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 Übersetzung für 'chip-to-chip' von Englisch nach Deutsch
tech.
chip-to-chip time
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Übersetzung für 'chip-to-chip' von Englisch nach Deutsch

chip-to-chip time
Span-zu-Span-Zeit {f}tech.
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Anwendungsbeispiele Englisch
  • Alignment time and chip-to-chip variability are likewise reduced.
  • This first demonstration was based on a 45 nm SOI node, and the bi-directional chip-to-chip link was operated at a rate of 2×2.5 Gbit/s.
  • Following this lead, the majority of chip-to-chip connection standards underwent an architectural shift from parallel buses to serializer/deserializer (SERDES) links called "lanes."
  • SPI-3 or System Packet Interface Level 3 is the name of a chip-to-chip, channelized, packet interface widely used in high-speed communications devices.
  • There are two broad categories of chip-to-chip interfaces.

  • The SATURN Development Group was an important industry forum that enabled the specification of chip-to-chip interfaces for the communications industry.
  • The System Packet Interface (SPI) family of Interoperability Agreements from the Optical Internetworking Forum specify chip-to-chip, channelized, packet interfaces commonly used in synchronous optical networking and Ethernet applications.
  • Based on industry-standard electrical specifications such as those for Ethernet, RapidIO can be used as a chip-to-chip, board-to-board, and chassis-to-chassis interconnect.
  • No floating-point arithmetic is used in WavPack's data path because, according to the author, integer operations are less susceptible to subtle chip-to-chip variations that could corrupt the lossless nature of the compression (the Pentium floating-point bug being an example).
  • The implementation of XAUI as an optional XGMII Extender is primarily intended as a chip-to-chip (integrated circuit to integrated circuit) interface implemented with traces on a printed circuit board.

  • InterChip USB is a chip-to-chip variant that eliminates the conventional transceivers found in normal USB.
  • Rambus's technology was based on a very high speed, chip-to-chip interface that was incorporated on dynamic random-access-memory (DRAM) components, processors and controllers, which achieved performance rates over ten times faster than conventional DRAMs.
  • Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically robust chip-to-chip interconnections.
  • Because of these benefits of electrical transmission, optical communication is not common in short box-to-box, backplane, or chip-to-chip applications; however, optical systems on those scales have been demonstrated in the laboratory.
  • Optics has widespread use in long-distance communications; still it has not yet been widely used in chip-to-chip or on-chip interconnections because they (in centimeter or micrometer range) are not yet industry-manufacturable owing to costlier technology and lack of fully mature technologies.

  • These techniques included wafer scale integration (WSI), with the goal of producing a computer chip that was 2.5 inch on one side.
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Enthält Übersetzungen von der TU Chemnitz sowie aus Mr Honey's Business Dictionary (nur Englisch/Deutsch).
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