Übersetzung für 'wafer edge' von Englisch nach Deutsch

wafer edge

Waferkante {f}electr.

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edge of (the) wafer

Waferkante {f}electr.

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Werbung

gallium arsenide wafer <GaAs wafer>

GaAs-Wafer {m} [Wafer aus Galliumarsenid]electr.tech.

wafer

Siliziumscheibe {f}

Scheibe {f}comp.

Kristallplättchen {n}

Waffel {f} [dünn]gastr.

Wafer {m}electr.

edge-to-edge bite

Kopfbiss {m}dent.

Zangenbiss {m}dent.

Kantenbiss {m}dent.

gerader Biss {m}dent.

wafer biscuit

Waffelkeks {m}gastr.

substrate wafer

Substrat-Wafer {m}electr.

Substratwafer {m} [auch: Substrat-Wafer]electr.

silicon wafer

Siliziumscheibe {f}

wafer-thin {adj}

hauchdünn [Scheiben, Täfelchen]

wafer curls

Waffelröllchen {pl}gastr.

Neapolitan wafer

Neapolitanerschnitte {f} [österr.]gastr.

Neapolitaner-Waffel {f} [auch: Neapolitanerwaffel]gastr.

wafer fabrication

Waferherstellung {f}

wafer cake

Oblate {f} [waffelähnliches Gebäck]gastr.

• Alternatively, if the hole has already been milled through the substrate, the argon beam is aimed at the wafer, and by lateral mass transport atoms from elsewhere on the wafer move to the edge of the hole.
• Additionally, because VCSELs emit the beam perpendicular to the active region of the laser as opposed to parallel as with an edge emitter, tens of thousands of VCSELs can be processed simultaneously on a three-inch gallium arsenide wafer.
• At the edge of a diode laser, where light is emitted, a mirror is traditionally formed by cleaving the semiconductor wafer to form a specularly reflecting plane.
• Lam's bevel clean technology directs a plasma at the very edge of the wafer to clean unwanted particles, residues, and films.
• A common issue in spin coating is a "beading" up of solvent at the edge of the silicon wafer.

• Plessey continues to operate in the Roborough site with leading-edge 150mm and 200mm wafer processing facilities to undertake design, test and assembly of products, and a comprehensive suite of photonic characterisation and applications laboratories.
• This mask was given to Sprague Electric Company of North Adams, Massachusetts which imaged it onto a silicon wafer and etched the pattern into the wafer.
• It built a second 300mm wafer fab, IM Flash Singapore, which opened in April 2011.
• In the semiconductor industry, wafers have two typical edge types: a slanted beveled shape or a rounded bullet shape.
• It is used in the production of semiconductors to sputter thin layers of metal films on the surface of the wafer.

• Modern cleanrooms use automated, robotic wafer track systems to coordinate the process.
• Photoelectrowetting can be used to circulate aqueous solution-based sessile droplets on a silicon wafer covered with silicon dioxide and Teflon – the latter providing a hydrophobic surface.
• The atomic wafer surface layers are fused into the glass at an atomic level.
• When used for solar cells, the wafers are textured to create a rough surface to increase surface area and so their efficiency.
• The diffusion of these metals requires good knowledge of the CTE differences between the two wafers to prevent resulting stress.