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 Übersetzung für 'encapsulation' von Englisch nach Deutsch
NOUN   an encapsulation | encapsulations
encapsulationVerkapselung {f}
166
encapsulationAbkapselung {f}
26
comp.
encapsulation
Datenkapselung {f}
21
encapsulationEinkapselung {f}
14
comp.
encapsulation
Kapselung {f} [Datenkapselung]
9
encapsulationEinkapseln {n}
7
tech.
encapsulation
Vergusskapselung {f}
2 Wörter
comp.
data encapsulation
Datenkapselung {f}
comp.
data encapsulation
Datenverkapselung {f}
chem.med.tech.
micro-encapsulation
Mikroverkapselung {f}
med.pharm.
placenta encapsulation
Plazentaverkapselung {f} [auch: Plazenta-Verkapselung]
3 Wörter
comp.
key encapsulation mechanism <KEM>
Schlüsselkapselungs­verfahren {n}
12 Übersetzungen
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Anwendungsbeispiele Englisch
  • Another encapsulation method is Multiprotocol Encapsulation (MPE) which was developed and standardized by the DVB project.
  • Atomic layer deposition (ALD) dielectric layer and/or hydrophobic polymer is used as encapsulation layers in order to prevent device degradation and failure.
  • In 1933, Scherer invented the rotary die encapsulation process, revolutionizing the soft-gelatin encapsulation field.
  • Coupling refers to the degree of direct knowledge that one component has of another. Loose coupling in computing is interpreted as encapsulation vs. non-encapsulation.
  • The CellML specification defines two types of relationship, encapsulation and containment, however more can be defined by the user.

  • Encapsulation is another challenge for flexible OLED devices.
  • The liposome encapsulation of vincristine enhances the efficacy of the vincristine drug while simultaneously decreasing the neurotoxicity associated with it.
  • Due to incompatibilities with modern M48T02s, it is common to modify failed NVRAMs by cutting into the encapsulation and patching in a new battery.
  • Likewise, thin film encapsulation can trap fabrication byproducts in the cavities.
  • Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress.

  • This procedure is mostly used for hermetic encapsulation of micro-mechanical silicon elements.
  • Encapsulation is the application of a liquid layer to very small particles.
  • Also mounting of naked dies (the actual silicon chip without encapsulation) and wire bonding is a standard process, this provides the basis for miniaturization of the circuits as all the extra encapsulation is not necessary.
  • Methods also provide the interface that other classes use to access and modify the properties of an object; this is known as "encapsulation".
  • Virtual circuit multiplexing or VC-MUX is one of the two (the other being LLC encapsulation) mechanisms for identifying the protocol carried in ATM Adaptation Layer 5 (AAL5) frames specified by [...] , Multiprotocol Encapsulation over ATM.

  • One main physiological issue that current long-term implanted electrodes suffer from are fibrous glial encapsulations after implantation.
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Enthält Übersetzungen von der TU Chemnitz sowie aus Mr Honey's Business Dictionary (nur Englisch/Deutsch).
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