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 Übersetzung für 'fabrication defect' von Englisch nach Deutsch
NOUN   a fabrication defect | fabrication defects
fabrication defectHerstellungs­fehler {m}
tech.
fabrication defect
Fabrikationsfehler {m}
Teiltreffer
fabricationHerstellung {f}
133
fabricationPhantasiegespinst {n} [Rsv.]
25
fabricationErfindung {f}
91
fabricationVorfertigung {f}
5
fabricationFertigung {f}
26
ind.
fabrication
Produktion {f} [Fabrikation]
9
ind.
fabrication
Verfertigung {f} [Fabrikation]
tech.
fabrication method
Herstellungs­methode {f}
ind.
batch fabrication
Serienfertigung {f}
ind.
fabrication machine
Fertigungs­maschine {f}
fabrication techniqueHerstellungs­methode {f}
pure fabricationreine Erdichtung {f}
ind.tech.
fabrication process
Fertigungs­prozess {m}
tech.
fabrication step
Fertigungs­schritt {m}
wafer fabricationWaferherstellung {f}
shop fabricationWerkstattfertigung {f}
fabrication [manufacture]Fabrikation {f}
ind.tech.
fabrication method
Fabrikationsverfahren {n}
ind.tech.
fabrication method
Herstellungs­verfahren {n}
ind.tech.
fabrication method
Fabrikationsmethode {f}
22 Übersetzungen
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Anwendungsbeispiele Englisch
  • The cold welding approach has the advantage of reducing surface contact contamination or defect due to no heating process, which is a main problem in the latest development and fabrication of organic electronic devices as well as novel solar cells.
  • Whiskers are used in some composites, but large-scale fabrication of defect-free whiskers is very difficult.
  • For example, SESAMs require complex and costly clean-room-based fabrication systems such as Metal-Organic Chemical Vapor Deposition (MOCVD) or Molecular Beam Epitaxy (MBE), and an additional substrate removal process is needed in some cases; high-energy heavy-ion implantation is required to introduce defect sites in order to reduce the device recovery time (typically a few nanoseconds) to the picosecond regime required for short-pulse laser mode-locking applications; since the SESAM is a reflective device, its use is restricted to only certain types of linear cavity topologies.
  • Process temperature limitations can be addressed by partitioning the transistor fabrication into two phases.
  • The name "cleanroom" was chosen to evoke the cleanrooms used in the electronics industry to prevent the introduction of defects during the fabrication of semiconductors.

  • These size requirements necessitate a more complex fabrication process, which further adds to the production of fewer functional processors per single silicon wafer.
  • All these can further demonstrates the utility of this innovative approach for device fabrication.
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Enthält Übersetzungen von der TU Chemnitz sowie aus Mr Honey's Business Dictionary (nur Englisch/Deutsch).
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